0.8 mm Ibhodi ukuya kwisinxibelelanisi seBhodi – 11.7mm Ubude obusetyhini
Ibhodi yeRow ephindwe kabini ukuya kwiBhodi yokudibanisa
● IiNgcaciso zeMveliso
• Ukupheliswa kwe-SMT
• Isinxibelelanisi semiqolo emibini
• Amaxabiso edatha ukuya kuthi ga kwi-12 Gbit/s
• Izikhonkwane zendawo zokubekwa kwebhodi ngqo
• Idibano yebhodi ezenzekelayo
● Imizobo enemilinganiselo
Ukuodola Ulwazi
| Hayi.of Izikhonkwane | Ukupakishwa | Icandelo lamanani |
| 30 | Iteyiphu kunye ne-reel | I-ZIV30S4E0B |
| 40 | Iteyiphu kunye ne-reel | I-ZIV40S4E0B |
| 50 | Iteyiphu kunye ne-reel | I-ZIV50S4E0B |
| 60 | Iteyiphu kunye ne-reel | I-ZIV60S4E0B |
| 80 | Iteyiphu kunye ne-reel | I-ZIV80S4E0B |
| 100 | Iteyiphu kunye ne-reel | I-ZIVA0S4E0B |
| 120 | Iteyiphu kunye ne-reel | ZIVC0S4E0B |
| 140 | Iteyiphu kunye ne-reel | ZIVE0S4E0B |
● Ingcamango
Ibhodi ye-0.8mm kwibhodi edibeneyo ye-Plastron yisisombululo esiguquguqukayo esenzelwe isantya esiphezulu kunye nokuhanjiswa kwedatha ye-high-density transmission parallel board-to-board connector system kunye ne-16 PCB ukuphakama kwe-stack kwi-9 ubukhulu ukuya kwizikhundla ze-140.
• Iprofayili yezindlu kunye netheminali iqinisekisa isantya sothumelo lwedatha ukuya kuthi ga kwi-12Gb/s
• Ulungelelwaniso oluthe nkqo luthelekiswa ngokuthe nkqo
• I-30 ukuya kwi-140 ubukhulu bendawo kwi-20 yokunyuswa kwendawo
● Ulwazi Lobugcisa
Inkcazo
Ingqibelelo yomqondiso
Ukuqina: 100 imijikelo yokukhwelana
Amandla okukhwelana: 150gf max./ Isibini soqhagamshelwano
Amandla angalinganiyo: 10gf min./ Isibini soqhagamshelwano
Ubushushu bokusebenza: -40℃~105 ℃
Ubomi bobushushu obuphezulu: 105±2℃, iiyure ezingama-250
Ukumelana ne-Insulation: 100 MΩ
Ilinganiswe ngoku: 0.5~1.5A/iphini nganye
Ukuchasana noqhagamshelwano: 50mΩ
Umbane olinganisiweyo: 50V ~ 100V AC / DC
Ubushushu obuthe rhoqo kunye nokufuma: Ukufuma okuhambelanayo 90~95% 96 iiyure
Uluhlu lweimpedance eyahlukileyo: 80~110Ω 50ps (10~90%)
Ilahleko yokufaka:＜1.5dB 6GHz/ 12Gbps
Ilahleko yokubuyisela:＜ 10dB 6GHz/ 12Gbps
I-Crosstalk: ≤ -26 dB 50ps (10~90%)
Female End Material
● INdibano ezenzekelayo ngokuPheleleyo kunye ne-Reflow Soldering
● Iimpawu
